Flex delivers new solutions to tackle power, heat, and scale challenges in the AI era

Flex announced new solutions to sustainably accelerate data center growth for cloud service providers. These innovations build on Flex’s ability to address technical challenges associated with power, heat generation, and scale to support artificial intelligence (AI) and high-performance computing (HPC) workloads.

Flex will showcase these solutions, including:  

• Reference platforms for liquid-cooled servers based on a new partnership with JetCool Technologies  
• Flex’s ORv3-compatible rack integrated with single-phase liquid cooling, enabled for two-phase liquid cooling 
• Intermediate bus converter products designed for AI workloads

Let’s dive into more detail about the new innovations on display at Flex’s booth A11 during the 2024 OCP Global Summit.

Liquid-cooled servers and racks for AI workloads

Flex announced customizable, open standards-based compute reference designs that integrate JetCool’s SmartPlate™ direct-to-chip liquid cooling solution. JetCool’s patented microconvective cooling^® technology extends the value of single-phase, direct-to-chip liquid cooling deployments by cooling over 1,500W per socket, providing more than enough headroom to accommodate the most advanced AI servers.

Flex and JetCool announced a partnership to deliver liquid-cooled solutions at scale. According to the Uptime Institute’s 2023 Cooling Systems Survey, direct liquid cooling is expected to surpass air cooling as the primary method for cooling IT infrastructure by the end of the decade. 

“JetCool extends the value of single-phase, direct-to-chip liquid cooling deployments to meet the escalating power demands of AI servers,” said Rob Campbell, president of Communications, Enterprise, and Cloud at Flex. “Flex’s expertise across IT and power infrastructure, global manufacturing, and vertical integration makes these solutions easier to deploy at scale.”

“As AI and other high-density workloads push the limits of conventional cooling methods, the need for advanced solutions becomes critical,” said Dr. Bernie Malouin, CEO of JetCool. “Partnering with Flex allows us to combine our cutting-edge liquid cooling solutions with Flex’s unparalleled manufacturing capabilities.” 

Flex will showcase JetCool’s SmartPlate and coolant distribution unit products for single-phase direct-to-chip liquid cooling at booth A11 and will present on the technology during an Expo Session titled “Liquid-Cooled Server and Rack Innovations at Scale” at 9:20 AM PT on October 16, 2024, at the Expo Hall Stage.  

During the session, Flex will discuss how end-to-end solutions enable the cloud ecosystem and showcase our liquid-cooled server reference platforms and rack and chassis mechanicals. JetCool will share details about its leading liquid-cooled server and rack solutions.  

Compute platform designs for AI and HPC workloads 

The Flex compute reference design is based on a next-generation modular compute platform that supports the Host Processor Module (HPM) customized to meet the unique requirements of different AI and HPC applications. This modular compute platform includes a new HPM that supports up to two Intel^® Xeon^® 6900 series with P-cores, the latest generation of data center processors from Intel. Intel will showcase the Flex Modular Compute Platform on its Wall of Fame at the OCP Global Summit.

The platform also integrates the Flex Secure Control Module (SCM) 2.0 that supports server management, security, and control functions in a common form factor, making it adaptable for various environments, including vertically integrated rack solutions.

The next generation of the Flex SCM delivers improved connectivity, root of trust security, and compliance with the latest OCP DC-SCM 2.0 specification.  

Flex SCM supports Intel Platform Firmware Resilience (Intel^® PFR) 4.0, which aligns with guidelines from the National Institute of Standards and Technology (NIST). NIST 800-193 recommends building firmware resilient capable servers to protect against permanent denial of service firmware attacks, beginning with a platform root of trust. In addition, the Flex SCM aligns with emerging data security requirements, such as CNSA 2.0 (Commercial National Security Algorithm — CNSA) and Post-Quantum Cryptography (PQC) cryptographic algorithms from NSA. 

New power modules expand offering for advanced compute workloads 

Flex Power Modules launched new Intermediate Bus Converters (IBC) designed to meet the demands of data centers powering AI, machine learning, and cloud applications. These DC/DC power converters boast a peak efficiency of over 98% while adhering to the Open Compute Project (OCP) standard OAM V2.0.

The BMR321 delivers a continuous power output of 750W and up to 1,500W when paralleled with up to two units, and a new variant of the 400W continuous power rated BMR320 is also available, offering up to 740W peak power for applications that require lower power outputs within a compact footprint. Up to three BMR320 variants can be paralleled, offering scalable power delivery to meet varied system demands.  

Flex previewed the new BMR323 variant, which promises even higher continuous and peak power capabilities in the same BMR320 form factor, set to be available in early 2025. 

About OCP Summit 

The OCP Summit is the premier event uniting the most forward-thinking minds in open IT Ecosystem development. The 2024 OCP Global Summit theme is “From Ideas to Impact”. This encapsulates the transformative journey at the heart of the Open Compute Project. This year’s theme reflects OCP’s commitment to fostering innovation that transcends theoretical discussions and manifests into real-world solutions. As the pace of technological evolution accelerates and development cycles shorten, the industry is forced to rapidly respond to emerging trends and needs. By harnessing the collective expertise of a global community, the OCP community turns visionary ideas into groundbreaking technologies that drive openness, efficiency, sustainability, scalability and growth in the data center industry.